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Search resuls for: "Ankur Gupta"


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Researchers have proposed an explanation for how the patterns form based on the "Turing patterns." A question naturally arises: How can distinct color patterns form in the presence of diffusion? Our work suggests that combining the conditions that form Turing patterns with diffusiophoresis could also form the basis of artificial skin patches. Just like adaptive skin patterns in animals, when Turing patterns change — say from hexagons to stripes — this indicates underlying differences in chemical concentrations inside or outside the body. Besides animal skin patterns, Turing patterns are also crucial to other processes such as embryonic development and tumor formation.
Persons: , Ben Alessio, Alan Turing, Turing, diffusiophoresis, Keld, Ankur Gupta Organizations: Service, Getty Images, micron, University of Colorado Locations: Denmark, University of Colorado Boulder
But Turing’s theory didn’t explain how the patterns would remain so defined in a species such as the ornate boxfish. The team of engineers at the University of Colorado Boulder explored how a mechanism called diffusiophoresis might create sharp patterns in a new study published Wednesday in the journal of Science Advances. … It is at least one possible way to sharpen regions of gene expression,” said Krause, who was not involved in the study. “Cells are extremely sticky and are very unlikely to be moved by diffusiophoresis,” said Green, who was not involved in the study, in an email. Green coauthored a February 2012 study that had found evidence to support Turing’s theory when it came to the ridges on a mouse’s palate.
Persons: Alan Turing, creamer, , Ankur Gupta, diffusiophoresis, Gupta, Andrew Krause, Krause, Jeremy Green, Green, ” Green, ” Gupta Organizations: CNN, University of Colorado, University of Colorado Boulder, Durham University, University of Warwick, King’s College London Locations: University of Colorado Boulder, , United Kingdom, diffusiophoresis
Visitors walk under a Siemens sign at the international consumer technology fair IFA in Berlin, Germany September 2, 2022. REUTERS/Lisi Niesner/File PhotoSept 26 (Reuters) - Siemens Digital Industries Software, a unit of Siemens AG (SIEGn.DE), on Monday said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced packaging. But testing these chips after they are made has been difficult as there are several layers of tiles, and Siemens’ head of the Tessent business Ankur Gupta said until now Siemens has had to work with customers on a case-by-case basis. He said making the testing process easier for chips with advanced packaging, also referred to as 2.5 and 3-dimensional packaging, will help give the new technology a boost. Register now for FREE unlimited access to Reuters.com RegisterReporting by Jane Lanhee Lee; Editing by Stephen CoatesOur Standards: The Thomson Reuters Trust Principles.
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